Microelectronic packaging : edited by George Sideris. interconnection and assembly of integrated circuits /
Material type:
TextLanguage: English Publication details: New York : McGraw-Hill, c1968.Description: x, 299 p. : ill. ; 26 cmSubject(s): DDC classification: - 621.38173 MIC 1968
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Central Library, University of Rajshahi | Non-fiction | 621.38173 MIC 1968 (Browse shelf(Opens below)) | C-2 | Available | Sheeling | A25610 | |||||||||||
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Central Library, University of Rajshahi Reading Room | Non-fiction | 621.38173 MIC 1968 (Browse shelf(Opens below)) | C-1 | Not For Loan | A25609 |
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| 621.38173 HII 1976 Integrated circuit pocket book / | 621.38173 HII 1976 Integrated circuit pocket book / | 621.38173 JOE 1976 The engineering of microelectronic thin and thick films / | 621.38173 MIC 1968 Microelectronic packaging : interconnection and assembly of integrated circuits / | 621.38173 STF 1986 Fundamentals of integrated circuits / | 621.38173 STF 1986 Fundamentals of integrated circuits / | 621.381730223 NEV 1983 The VLSI designer's library : nMOS, [lambda]=2.5 [mu], with butting contacts / |
Includes bibliographies and index.
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