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Microelectronic packaging : interconnection and assembly of integrated circuits /

Microelectronic packaging : interconnection and assembly of integrated circuits / edited by George Sideris. - New York : McGraw-Hill, c1968. - x, 299 p. : ill. ; 26 cm.

Includes bibliographies and index.

Subjects--Topical Terms:
Microelectronics.
Integrated circuits.
Microelectronic packaging.

Dewey Class. No.: 621.38173 / MIC 1968

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