Microelectronic packaging : interconnection and assembly of integrated circuits / edited by George Sideris. - New York : McGraw-Hill, c1968. - x, 299 p. : ill. ; 26 cm. Includes bibliographies and index. Subjects--Topical Terms: Microelectronics.Integrated circuits.Microelectronic packaging. Dewey Class. No.: 621.38173 / MIC 1968